TH2000 是一个革命性的系统,它将双面晶圆探测能力与全面的测试资源相结合,包括电气测试、HV/HI 测试、翘曲和表面验证以及光学检测。
该系统执行完整的晶圆级高吞吐量测试,适用于最具挑战性的应用,包括功率器件、光电子学、直通裸片、多项目晶圆、复杂的片上系统和非常规布局,尺寸可达12英寸(300毫米)。
基于多个飞针卡的探测技术和精益测试流程(所有晶圆级测试都在单一步骤中完成),使 TH2000 能够显著降低您的测试成本。
八个独立的轴提供并行测试功能,从而缩短了整体过程时间(分度 + 测试时间)。 每个探针都可以与其他探针并行测试介质的专用区域,而单个裸片可以同时从顶部和底部接触。
实际 Z 轴高度经过轮廓分析,由每个轴进行自动补偿,以克服任何平面度问题。 通过晶圆的旋转平移对晶圆表面的精确定位进行监控和补偿,以便根据需要进行调整。
每个 XYZ 轴都使用带有高分辨率线性光学编码器的高速线性电机,以确保高吞吐量和最佳探测精度。 由天然花岗岩制成的系统底盘具有高刚度、出色的减振性和热稳定性,可避免由于移动速度和环境变化而导致的任何精度损失。
得益于可编程过载(低至 1 克)和受控运动配置文件,超软触摸技术使 TH2000 能够接触最精细和最小的裸片而不会留下痕迹。
TH2000 为半导体制造商带来了飞针技术的多功能性。每个 TH2000 轴都可以配备一个单点或多点探针卡,具有不同的裸片形状或间距,包括非常规和高密度的几何形状。 可以在不同轴上安装不同的探针卡,让 TH2000 也适用于测试多项目晶圆。
探针卡可以基于不同的技术(悬臂、弹簧探针、MEMS 探针、布线探针),并且可以根据每个裸片的密度/形状/分布进行设计:可测试性问题不再是您的晶圆布局的限制,可以通过设计以把每个裸片的成本降至最低。
TH2000 克服了传统晶圆探测器的局限性,扩展了可以在晶圆级进行全面测试的应用范围。
TH2000 轴可配备单个或多个裸片探针卡、激光计、高分辨率视觉单元,以执行所需的所有测试。 电气测试包括模拟、数字、混合信号、高压和大电流测试。 由于可以将带有信号调节资源的微型被测器件板直接放置在系统飞轴上,以尽可能靠近被测器件,因此可以执行最准确的测量。可以在两侧同时探测同一个焊盘,从而可执行精准测量而不受相邻焊盘影响。
机械测试包括平面度、高度和翘曲测试。
光学检测能够检测划痕、光刻和图案缺陷、颗粒存在、裂纹和瑕疵。
所有所需的晶圆级测试都在一个步骤中完成,使用相同的探测机器,无需额外的测试仪或检查站。您可以利用更少的测试设备足迹、更高的吞吐量和更低的测试成本。 TH2000 可以接受手动产品加载,也能以回传模式在测试单元中工作,并集成了自动装载机。
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