SPEA H5000 转塔式处理器专为执行高速度和高精度的半导体测试、检测和精加工而设计。其模块化设计带来了最大的配置灵活性,具有种类繁多的输入/输出媒介和测试单元,可满足各种处理需求。
H5000 可完全配置客户所需的所有输入、测试和精加工选项,实现灵活性和创新功能。您可以从广泛的输入、输出、测试和检测单元选项中创建自己的处理器:
同一配置上可以同时安装两种不同的输出选项(例如晶圆和卷带,或双卷带精加工),以进一步提高使用的灵活性。
热调节选项也可用于在高温下进行测试,而转换套件可用于在不同应用之间快速切换。
H5000 可以直接从薄膜框架晶圆上处理切割的裸片,在重建晶圆上输出或在磁带上完成精加工,这使得 H5000 成为 KGD 测试的理想选择。
> 进一步了解 SPEA KGD 测试解决方案
器件处理基于快速、力度受控的拾放装置,能够无损处理最小和最脆弱的器件,而不会对封装造成压力。线性执行器和电动拾取器可实现快速准确的处理,使用寿命长,无需维护。 自动拾取校准和自动拾放比例调整功能,增强了操作的自主性。
H5000 可以容纳多个可配置的电气测试站(最多 10 个),以验证半导体组件的完整性和功能。
为了进行电气测试,SPEA 测试仪可以直接置入到 H5000 底座单元中,也可以硬插接到处理器上。
> 进一步了解 SPEA 半导体测试仪
> 进一步了解 SPEA 功率半导体测试仪
SPEA H5000 转塔式处理器可执行完整的光学检查,以检验器件位置并检测 6 个侧面的任何表面缺陷。此外,在卷带精加工站上进行密封前和密封后检测。
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