SPEA可为大型半导体IDMS和OSAT提供最具成本效益和高性能的设备,用于测试汽车、SOCS、模拟混合信号设备、微机电系统传感器和执行器、功率和分立元件、识别设备,可做到最高的测量能力和最低的测试成本,以及最快的上市时间。
汽车和高性能混合信号设备对于最先进且功能最强大的测试仪器有着较高的市场要求,为此,我们可以提供高质量和低成本的测试解决方案。
SPEA的DOT平台和C600MX系统可满足了当今和未来的发展需求。
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例如电动和混合动力汽车、太阳能光伏、风能等应用,使得IGBT、MOSFET和功率模块在半导体市场中变得越来越重要。
DOT800和C430MX平台可提供用来满足这些设备测试要求的仪器,在扩展的电流/电压范围内进行静态和动态测量。
性能水平随着安全措施和保护措施的执行而得到提高,例如峰值检测能力、开尔文警报、保护电路,旨在确保操作员、DUT和测试系统本身的绝对安全。
微机电系统市场正在经历指数级的增长:微机电系统应用广泛用于各种设备,从服务器控件到汽车,再到医疗和工业应用。
DOT平台可进一步降低这些设备的平均销售价格和生产成本,使其生产量显著增长。
人们迫切地需要大幅度降低NFC、智能卡和识别设备的测试成本。而SPEA CT1000和CT3000正是低成本的测试系统,专门用于微控制器、射频识别、超高频、Combi设备。
这两款系统可进行完整的、高度精确的测量,提供高测试量,在晶片测试中具较高的多站点测试能力,以及用于内存测试的快速数据传输。
SPEA飞针测试仪是一种无夹具、可编程的测试设备,能够在相同的机器设置下对测试电路板、探针卡和电子板进行测试。可以测试最大一平方米,最重30公斤的产品,同时还可以无损坏地轻触最小焊点(50μm,甚至更小)。
与传统的直接在集成电路测试仪上进行测试电路板诊断序列的做法相比,SPEA飞针测试仪具有巨大的优势:测试只需十分之一的时间即可完成,而精确的诊断结果可将修复时间缩短到几分钟。此外,越高的故障检测能力,越少的现场故障发生。
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