半导体探针卡用于晶圆级 IC 测试,是半导体测试设备与被测器件焊盘之间的接触界面。
探针卡通常安装在晶圆探针上,并连接到测试仪。在这些电路组件中,一个缺陷就会影响到接触的可靠性,从而影响测试结果。因此,在半导体测试系统上使用探针卡之前必须检验其完整性,以确保没有缺陷存在,并能正确接触和测试半导体器件。
通常会在使用探针卡的同一半导体测试仪上运行特定的诊断程序,对探针卡进行测试。虽然这很常见,但这种做法有几个缺点:
SPEA 飞针测试仪可以提高质量,同时在探针卡的各个制造阶段节省成本。它们的精确探测能力以及测量精度和精确诊断也为陶瓷板测试、缺陷探针卡的故障排除以及修复后的探针卡检验创造了巨大的附加值。
它们可以最终组装在 PCB 上之前测试陶瓷板,然后对组装好的探针卡进行完整的最终测试。此外,它们还可用于对有缺陷的探针卡进行故障排除和维修检验测试。
飞针能够直接接触探针卡连接器引脚,在 PCB 和陶瓷板之间执行完整的连续性测试,无需专门针对特定应用的接口板或夹具。此外,它们可以彻底测试 PCB 和陶瓷板上的所有探针卡部件,检测有缺陷的组件、工艺缺陷(例如开路引脚或短路)以及不符合规格的嵌入式组件。
与 SPEA 专家交谈>
基于在 XYZ 轴上带有线性编码器的全线性运动架构,SPEA 飞针测试仪能够准确可靠地接触最小的探针卡引脚,符合当今的小型化趋势。软接触技术确保焊盘表面不留任何痕迹,保证产品的完整性。
SPEA 飞针测试仪具有在不同高度水平同时探测的能力,能够执行 PCB 和陶瓷板之间的连续性测试,此外还可以对最终组装后的陶瓷板进行完整的参数和功能测试。
SPEA 飞针测试仪具有宽大的测试区域,可以安装最大尺寸高达 1200x668mm (47.2 × 26.3″)的探针卡,而输入传送模块可以轻松加载最重的探针卡(最大 20Kg),毫不费力地自动加载到测试区域。
SPEA 飞针测试仪配备多达 4 个顶部和 4 个底部移动头,可同时测试探针卡的两端,从而检验从顶部到底部的网络连续性。
SPEA 飞针测试仪可以彻底测试任何类型的探针卡,准确检验每个网络和嵌入式组件的正常运作和参数值,以检测每个工艺缺陷或组件故障。
离线执行,无需在目标 IC 测试仪上花费数小时,无需专家工程师在场即可完成探针卡测试。 测试陶瓷板可以在 PCB 最终组装之前及早发现故障。针对发现的每个缺陷提供精确的诊断信息,大大减少修复探针卡所需的专业知识和时间。
当探针卡发生故障时,SPEA 飞针测试仪可简化修复过程。只需在已显示有缺陷的区域上运行飞针测试,就足以离线准确诊断故障部件,将 IC 测试仪的停机时间减少到几分钟,同时也最大限度地减少维修所需的时间。
此外,在将探针卡送回生产车间之前,可以在 SPEA 飞针测试仪上轻松执行修复后检验,获得完整的测试覆盖率,以检验修复操作是否有效,并且不存在其他故障。
借助 SPEA 电路板搬运设备,探针卡搬运和加载到测试区域的操作可以完全自动化。这些模块化单元,是市场上唯一能够直接从机架库中搬运大型探针卡的自动装载机。
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