相较于集成电路测试,微机电系统测试具有不同特点。除电气测试之外,它们要求特定类型的刺激以正确测试其在当前工作条件下将物理输入转换为电输出的能力。它们也要求使用专业设备进行处理,能够提供高吞吐量而不对内部微机械结构产生振动。最后而非最不重要的是,测试经常需要在特定温度下进行。
SPEA 被证实是微机电系统器件测试设备资质最高的供应商:SPEA 微机电系统测试单元结合了快速温和的拾取&放置处理器、可靠的接触和完整的最终测试能力,包括电气测试、功能测试物理刺激和校准,以及三温调节。这一切均由单个软件界面控制,为从设备编程到生产控制的整个过程提供易于使用的环境。
拾取&放置处理器
参数与功能测试
微机电系统特定刺激
器件校准
三温调节
接触界面
所有微机电系统测试单元的部件均由 SPEA 直接设计制造,让测试单元可作为一台最佳性能的单一机器运作。
这可保证最佳的技术性能、设备成本优化、一键式工厂集成。
它吞吐量高,投资额低,应用程序开发时间短,可快速适应各种应用,让测试成本大幅下降。
与SPEA专家交谈 >
可靠的微机电系统和传感器功能测试和校准,并不局限于器件的电气特性。它们也要求通过测量非电气行为,确定和分析器件的机械功能。
正因如此,SPEA 微机电系统测试单元能够完美复制多种器件的真实工作条件,施加器件所必须感应并回答的物理刺激。在施加刺激的过程中持续与测试源进行连接,让设备能够精准检查器件的正常工作状态。
测试源可嵌入刺激装置,或置于一个仅有测试头的紧凑测试仪中。
了解更多关于MEMS刺激测试的信息 >
SPEA 测试单元可在生产过程末对全封装器件执行完整的参数和功能测试,包括标准封装和 WLCSP 芯片级封装。
在测试完成后,器件将被直接发运至客户,无需进行其他工作或重新测试。
多种刺激可被结合于一个测试装置内,以测试微机电系统组合,例如环境传感器(压力+湿度+气体+温度)或导航传感器(加速度计+陀螺仪+指南针)。测试区域可在现场轻松重新配置各种测试装置。
进一步了解 SPEA 测试仪 >
高吞吐量的拾取&放置测试处理器(每小时最多可处理 33000 个单元),专为执行温和的微机电系统器件全自动处理而设计,对元件不施加额外的力。处理器结构为它赋予了最佳的灵活性,从而让配置可适应任何处理过程:它从托盘或碗式给料装置、蓝/紫外线卷带上的晶圆或条带拾取器件,将之转移到测试区域,再在测试结束后将之重新放置在托盘、卷带或盒子上。
进一步了解 SPEA 拾取&放置技术 >
采用创新的无氮系统,对需要在特定温度下测试的器件(温度传感器,也包括在极端条件下被激活工作的器件,例如汽车传感器)进行温度调节,温度范围在 -65 至 200°C 之间。
快速温度变化机制,单次插入即可测试不同温度:器件可留在同一插座上,依次进行要求的温度测试。这可降低整体成本,减少要求的处理操作数量,同时保证校准精度更高,器件追踪更容易。
SPEA 提供的测试单元配备了以测试仪器进行测试的器件所要求的所有对接和接触工具。
插座和接触单元均由 SPEA 内部开发,既适用于最通用的集成电路封装(有引线或无引线),也适用于定制封装,在微机电系统测试中提供最佳性能:
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